Seamless Sealing: Henkel’s Sonderhoff FIPFG Foam Gasket Technology
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Seamless Sealing: Henkel’s Sonderhoff FIPFG Foam Gasket Technology
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What if seals could be created directly on your part—no cutting, no insertion, no seams? In this episode of Adhesion Matters, we dive into Henkel’s Sonderhoff Formed-in-Place Foam Gasket (FIPFG) technology, a system that applies liquid foam directly onto components where it cures into seamless, precise, and highly resilient gaskets. We explore how polyurethane systems like FERMAPOR K31 and silicone foams like FERMASIL are transforming sealing in industries ranging from electronics enclosures and automotive modules to household appliances and e-mobility charging stations.
Beyond technical performance, we highlight how FIPFG advances sustainability—eliminating waste from punched gaskets, reducing energy with room-temperature curing, and offering long service life through exceptional compression recovery. We also examine the role of automation and robotics in enabling consistent, scalable application.
Whether you’re an engineer, product designer, or operations manager, this episode shows why the future of gasketing is being shaped—in place.